Via-In-Pad Design Guidelines and Manufacturing Process for PCB
Via-in-pad (VIP) is a critical PCB design technique where vias are drilled directly on SMD and BGA pads to support high-density interconnects. This guide covers via-in-pad fundamentals, design rules, manufacturing processes, and comparisons between VIP and non-VIP processes to ensure reliable PCB assembly and performance. What Is Via-In-Pad? Via-in-pad (VIP) means drilling vias directly on…