HDI PCB is an advanced printed circuit board technology for high‑component‑density electronics. This guide covers core HDI PCB layout principles, via design, trace rules, stackup, and IPC standards for engineers and buyers. What Is HDI PCB Layout? High Density Interconnects (HDI PCB) layout refers to advanced PCB design techniques used when trace widths drop below…
Via-in-Pad technology places vias directly within surface mount pads to save space, improve routing efficiency, and enhance PCB density for HDI and high-speed designs. What Is Via-in-Pad Technology for PCBs? Before understanding via-in-pad, let’s review common PCB via types: Plated-through holes (PTHs) span the entire board, blind/buried vias connect partial layers, and microvias (~0.1mm) link…
This professional guide covers HDI PCB layout practices, stack-up, microvias, routing rules, DFM, impedance control and IPC standards to help engineers and procurement teams build reliable, mass-producible HDI PCB for high-speed, miniaturized electronics. What Is HDI PCB Layout HDI PCB (High-Density Interconnect) layout refers to design methods used when trace widths drop below 8 mils…