Learn what tented vias are, how they work, key benefits, IPC standards, design rules, and best applications for high‑performance PCB manufacturing and assembly. What Is a Tented Via in PCBs? A tented via is a plated through‑hole (PTH), blind via, or buried via fully or partially covered with solder mask on one or both sides…
Via-in-Pad technology places vias directly within surface mount pads to save space, improve routing efficiency, and enhance PCB density for HDI and high-speed designs. What Is Via-in-Pad Technology for PCBs? Before understanding via-in-pad, let’s review common PCB via types: Plated-through holes (PTHs) span the entire board, blind/buried vias connect partial layers, and microvias (~0.1mm) link…
Plated half-holes (also known as castellated holes) offer a space-efficient, reliable method for interconnecting PCB modules through direct soldering. Positioned at board edges, they simplify assembly, improve alignment, and boost mechanical stability compared to traditional bottom pads. This guide covers structure, design rules, fabrication, benefits, applications, and best practices for engineers and buyers. What Are…
Complete professional guide to multilayer PCB stackup design, standard thicknesses, layer arrangements, impedance control, and ready-to-use 4–14 layer configurations for industrial, high-speed, and high-reliability electronics. Why Multilayer PCB Stackup and Thickness Matter Today’s electronics demand smaller size, higher speed, greater integration, and longer reliability. Multilayer PCB stackup and total board thickness directly determine signal integrity,…
PCB vias connect layers in multilayer circuit boards, enabling compact, high-performance electronics. This guide covers plated through holes, blind, and buried vias, their design, manufacturing, and advantages in modern PCB fabrication. From 5G devices to automotive systems, understand how to choose the right via type for your project. What Are PCB Vias? A PCB via…
This professional guide covers HDI PCB layout practices, stack-up, microvias, routing rules, DFM, impedance control and IPC standards to help engineers and procurement teams build reliable, mass-producible HDI PCB for high-speed, miniaturized electronics. What Is HDI PCB Layout HDI PCB (High-Density Interconnect) layout refers to design methods used when trace widths drop below 8 mils…
Blind vias and buried vias are core structures for high‑density interconnect (HDI) and high‑speed PCBs. They boost routing density, signal integrity, and miniaturization while optimizing layer stackups. This guide covers definitions, differences, design rules, manufacturing, and industrial applications for global engineers and buyers. Introduction As printed circuit boards become more compact and integrated, advanced via…
PCB vias connect layers in multilayer circuit boards, enabling compact, high-performance electronics. This guide covers plated through holes, blind, and buried vias, their design, manufacturing, and advantages in modern PCB fabrication. From 5G devices to automotive systems, understand how to choose the right via type for your project. PCB vias are the unsung heroes of…
PCB stackup design directly determines signal integrity, EMI control, power stability and manufacturing reliability. This guideline provides professional, field-proven best practices for 2‑layer PCB stackup, 4‑layer PCB stackup and 6‑layer PCB stackup for industrial electronics, communications equipment and high‑speed digital products. Introduction to PCB Stackup Design PCB stackup design is the foundation of high‑performance printed…
Advanced controlled impedance PCB manufacturing for high-speed, RF and telecom designs, delivering precise 50 Ω / 90-100 Ω impedance, tight tolerances and fast global turnaround. Tight-tolerance controlled impedance: 50 Ω single-ended and 90/100 Ω differential traces engineered for consistent signal integrity. Multilayer stackups with FR-4 and high-frequency materials (Rogers, hybrid) for complex high-speed designs. Full…