Flexible PCB fabrication, FPC manufacturing capabilities

PCB Manufacturing Capabilities

We continuously upgrade PCB manufacturing processes to maintain our core competitive advantage. Our enhanced capabilities deliver cutting-edge production technologies while reducing total costs for global industrial buyers, engineers, and procurement teams.

Full Technical Capabilities of Our PCB Manufacturing & SMT Assembly Services

We support full-cycle production for all standard and advanced PCB types, paired with reliable SMT assembly for prototype through mass-production orders.

Rigid Printed Circuit Boards

Rigid PCB Manufacturing Capabilities

  • Layers: 1-30
  • MOQ: 1 pc
  • Materials: FR4, Aluminum, etc.
  • Laminate: Shengyi, Isola, etc.
  • Thickness: 0.1-8.0 mm
  • Max Size: 533.4 × 762 mm
  • Lead Time: 24 Hours – 9WD
  • Types: LED PCB, HDI PCB, Flexible PCB, Rigid-flex PCB, High Tg PCB, etc.
Rigid PCB manufacturing capabilities, multilayer PCB production

Flexible Printed Circuit Boards

Flexible PCB Fabrication Capabilities

  • Layers: 1-10
  • MOQ: 1 pc
  • Laminate: Dupont PI, Shengyi PI
  • Minimum Hole Size: 0.1 mm
  • Thickness: 0.05 mm ±0.02 mm
  • Max Size: 480 × 4000 mm
  • Panelization Size: 250 × 510 mm
  • Lead Time: 24 Hours – 9WD
  • Solder Mask Color: Green, White, Blue, Black, Red, Yellow, etc.
Flexible PCB fabrication, FPC manufacturing capabilities

Rigid-Flex Printed Circuit Boards

Rigid-Flex PCB Fabrication Capabilities

  • Layers: 1-12
  • Laminate: Dupont PI, Halogen Free
  • Thickness: 0.20 – 5.50 mm
  • Max Size: 610 × 640 mm
  • Impedance Control: ±10%
  • Surface Finish: HASL (LF), ENIG, Immersion Tin/Silver
  • Solder Mask Color: Green, White, Blue, Black, Red, Yellow, etc.
Rigid-flex PCB manufacturing, high reliability rigid flex boards

High Density Interconnector (HDI) PCBs

HDI PCB Manufacturing Capabilities

  • Layers: 4-24
  • MOQ: 1 pc
  • HDI Structures: 1+N+1, 2+N+2, 3+N+3
  • Quality Grade: Standard IPC 2
  • Build Time: 2 days – 5 weeks
  • Material: FR4 standard Tg 140°C | FR4 High Tg 170°C, etc.
  • Board Size: Min 6×6 mm | Max 457×610 mm
  • Board Thickness: 0.4 mm – 3.0 mm
HDI PCB manufacturing capabilities, high density interconnect PCB

PCB SMT Stencil Manufacturing

PCB Stencil Fabrication Capabilities

  • Technology: 100% laser cut
  • Types: Framed, Frameless, Electroformed, Nano Coating
  • Material: Stainless Steel
  • Stencil Thickness: 0.06 ~ 0.3 mm
  • Minimum Cut Width: 0.05 mm
  • Maximum Size: 736 × 736 mm
  • Aperture Tolerance: within 0.007 mm
  • Fiducial Data Support: Yes
  • Panelized Data Support: Yes
  • Delivery: 1-2 days
SMT stencil manufacturing, laser cut PCB stencils

PCB Assembly (PCBA) Services

PCB Assembly PCBA Capabilities

  • PCB Types: Rigid, Flexible, Rigid-flex, Multilayer, etc.
  • PCB Size: 50×50 mm – 774×710 mm
  • Material: Rigid | Metal Core | FPC
  • Shape: Any custom shape
  • Quantity: Prototype to high volume, no MOQ
  • Services: Quick-turn prototype assembly, full turnkey solutions

PCB Type Comparison

PCB TypeLayersLead TimeBest For
Rigid PCB1-3024h-9WDGeneral electronics, industrial controls
Flex PCB1-1024h-9WDWearables, compact devices
HDI PCB4-242d-5wHigh-tech, miniaturized products

Conclusion

Our full-spectrum PCB manufacturing capabilities enable us to support projects from early prototype to large-scale global export. We combine advanced processes, strict quality control, and fast lead times to help you reduce costs and speed up time to market.

Ready to Start Your PCB Projects?

Get DFM-optimized boards in as fast as 24 hours. 100% quality guaranteed for global export.

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