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HDI PCB Manufacturing – Microvia, Blind & Buried Via HDI Boards up to 30 Layers

HDI PCB manufacturing capabilities and technical specifications

We provide professional HDI PCB manufacturing with laser‑drilled microvias, blind vias, buried vias, and advanced stack‑ups for high‑performance, compact electronic devices. Our services include fast prototyping, controlled impedance, strict quality control, and full DFM engineering support.

What Is an HDI PCB and Why Choose It?

High‑density interconnect (HDI PCB) offers significantly higher wiring density than standard PCBs using microvias, blind and buried vias, fine lines, and thin‑core high‑performance materials.

By shortening signal paths, improving layer efficiency, and freeing routing space under fine‑pitch BGAs, HDI PCBs deliver smaller size, better signal integrity, higher reliability, and lower total system cost.

Key advantages of HDI PCB:

  • Pack more functions into a smaller footprint with microvias and via‑in‑pad
  • Improve signal integrity and reduce high‑speed noise
  • Lower layer count and reduce overall BOM cost
  • Enhance thermal performance and long‑term reliability
HDI PCB structure with microvia, blind via and buried via

HDI PCB Manufacturing Capabilities

We specialize in HDI PCB fabrication supporting up to 30 layers, with laser microvias, blind/buried vias, stacked/staggered structures, and controlled impedance for industrial, automotive, 5G, and medical applications.

ItemSpecification
HDI Structure1+N+1, 2+N+2, 3+N+3, Any‑Layer (ELIC)
Max LayersUp to 30 Layers
Min Trace/Space3/3 mil (0.075 mm)
Laser Microvia0.10 mm (4 mil), stacked / staggered
MaterialsHigh‑Tg, low‑loss, halogen‑free laminates
Surface FinishENIG, ENEPIG, Immersion Ag/Sn, HASL, Gold Fingers
CertificationsUL, ISO 9001, IATF 16949, RoHS
HDI PCB manufacturing capabilities and technical specifications

HDI Stackup Options for Different Designs

Selecting the right stackup balances HDI PCB density, performance, and cost.

1+N+1 HDI – Cost‑Effective Entry Level

Ideal for medium‑density designs, 0.5 mm BGA pitch, consumer electronics, IoT, and industrial controls.

1+N+1 HDI PCB stackup structure

2+N+2 & 3+N+3 HDI – High Density

For fine‑pitch BGAs (≤0.4 mm), high‑speed signals, 5G, automotive, and high‑end computing.

2+N+2 HDI PCB stackup structure

Any‑Layer (ELIC) HDI – Maximum Density

For ultra‑compact flagship devices, wearables, RF modules, and high‑speed computing.

Any-layer ELIC HDI PCB interconnection structure

Quality, Reliability & DFM Support

Our HDI PCB manufacturing uses strict process control and full inspection to ensure stability and longevity.

  • Controlled laser drilling, sequential lamination, copper filling
  • AOI, X‑ray, flying probe, and micro‑section analysis
  • Professional HDI DFM review for yield and reliability
  • Full material traceability and qualified laminate suppliers

HDI PCB Cost & Lead Time

Cost depends on stackup, layer count, microvias, materials, and tolerances. We help optimize design to reduce cost without sacrificing performance.

Typical Lead Time:

  • Prototype: 5–8 working days
  • Mass production: 10–15 working days
  • Expedited rush service available upon request

No MOQ for HDI PCB prototypes; secure file upload and 24‑hour engineering review.

Applications & Industries We Serve

Our HDI PCB manufacturing supports global customers in high‑reliability fields:

  • Automotive & EV: ADAS, ECU, infotainment, power control
  • 5G & Telecom: high‑speed modules, routers, base stations
  • Medical: portable devices, diagnostics, monitoring tools
  • Consumer electronics & wearables: smartphones, tablets, IoT
  • Industrial & IoT: automation, robotics, sensors

Summary

We are a professional HDI PCB manufacturing partner supporting up to 30 layers with microvias, blind/buried vias, controlled impedance, and full DFM support. Our UL, ISO, IATF 16949, and RoHS compliant processes ensure reliable quality for global industrial buyers, engineers, and procurement teams.

Request Your HDI PCB Quote Now

Upload your Gerber files and get a professional, fast quotation within 24 hours. No MOQ for prototypes.

Get HDI PCB Quote

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FAQs About HDI PCB Stackup, Process Specification & Project Selection

A: HDI adopts laser microvia/blind/buried via + ultra-fine trace to boost wiring density, shrink board dimension and optimize high-speed signal performance vs ordinary PTH PCB.

A:1+N+1 for IoT/regular industrial;2+N+2/3+N+3 for 5G/automotive;ELIC any-layer for flagship wearable and high-speed compact equipment.

A: Max 30 layers, min 3/3mil line space, laser microvia down to 0.10mm, stacked/staggered via & controlled impedance processing available.

A: ENIG,ENEPIG,Immersion Silver/Immersion Tin,HASL and gold finger plating matching different soldering and storage requirements.

A: Microsection for via filling check,AOI,X-ray,flying probe electrical test plus full DFM pre-production optimization review.

A: Prototype 5~8 working days, bulk production 10~15 working days; urgent expedited delivery service is negotiable.

A: Automotive ADAS/EV control,5G communication module,portable medical device,smartphone & wearable and industrial automation sensor.

A: Gerber/ODB++/IPC2581,stackup file,order quantity and special technical requirements such as impedance or special material.

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